During silicon-wafer cutting, metal particles, silicon swarf and moisture quickly contaminate the cutting fluid and reduce its performance. XTM010 monocrystalline-silicon cutting fluid is a fully synthetic water-based lubricating coolant with excellent lubrication, wetting and cooling. It rapidly wets the wafer, removes silicon particles and cutting impurities, improves cutting efficiency and reduces chip damage. It forms no pitch residue and contains no sulfur, phosphorus, halogens, phenols, nitrites, mineral oil, animal oil or ionic substances that could cause contamination.

Product characteristics

Excellent suspension capacity: can effectively suspend silicon carbide particles, improve cutting efficiency and reduce cutting consumption.
Good dispersibility: SiC particles can be distributed more evenly when mixed with the cutting fluid.
Excellent lubrication performance: a protective film can be formed on the surface of the wafer, reducing the cutting resistance and ensuring that the finished surface of the cut is smooth.
Excellent cooling performance: It can effectively dissipate heat and reduce cutting stress.
Powerful environmental performance: no irritation to the skin, no pollution to the environment, not easy to rot, long service life

Physical and Chemical Indicators